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AGC fluoropolymers are valuable for modern semiconductor manufacturing. Known for their exceptional chemical resistance and high purity, these materials are used to mold, insulate and protect critical components exposed to demanding conditions during chip production. As fabrication processes grow more advanced, fluoropolymers for semiconductor production have become the material of choice for manufacturers seeking clean, reliable and efficient operations.
What Are Fluoropolymers?
Fluoropolymers are synthetic polymers containing fluorine atoms. The strong carbon–fluorine bond gives them unique properties, including outstanding chemical resistance and excellent electrical insulation. These characteristics make them highly suitable for the extreme environments of semiconductor manufacturing.
AGC has been a pioneer in this field since the 1970s, starting with oil- and water-repellent fluorinated resins. In the 1980s, the company introduced PTFE resins and later expanded its portfolio with specialty products such as ETFE films. Today, AGC is recognized as the world’s leading producer of high-purity fluoropolymers for semiconductor production.
Semiconductor-Grade Fluoropolymers
AGC’s semiconductor-grade fluoropolymers are designed to meet the strict requirements of chip fabrication. Key performance benefits include:
- Ultra-high purity: Ensures minimal ionic contamination for defect-free circuit fabrication.
- Low melting point: Enables efficient processing, molding and fabrication with precise results.
- Non-stick surface: Prevents adhesion to molds or packages, reducing defects and improving throughput.
- Chemical inertness: Compatible with aggressive acids and solvents used in etching and cleaning.
- Broad chemical resistance: Withstands the corrosive substances common in semiconductor processes.
- Heat resistance: Performs reliably in environments above 260°C, which is critical for deposition and etching steps.
- Low outgassing: Reduces contamination risks in cleanroom and vacuum applications.
- Durability: Resists mechanical stress and harsh conditions typical of fabrication facilities.
High-Performance Fluoropolymers
AGC offers specialized grades to address diverse semiconductor applications:
- Fluon® PTFE (polytetrafluoroethylene): Widely used due to its resistance to most solvents, acids and bases. It withstands temperatures up to 260°C (500°F), offers excellent electrical insulation and remains flexible at cryogenic temperatures.
- Fluon PFA (perfluoroalkoxy alkane): A melt-processible copolymer of tetrafluoroethylene and a perfluorinated vinyl ether with chemical and electrical properties similar to PTFE, but with a broader temperature range and easier fabrication.
- Fluon ETFE (ethylene tetrafluoroethylene): A fluorine-based film noted for its flexibility and toughness, even at high temperatures, making it ideal for extreme conditions.
Other Materials for Semiconductor Production
AGC’s specialized materials help electronic components perform better and last longer. They strengthen signals, provide reliable insulation and remain stable at high temperatures. These materials are important for cleaning, protecting and improving electronic parts and circuit boards during semiconductor manufacturing.
- AMOLEA™ fluorosolvents: Safe, non-toxic cleaning agents for PCBs and semiconductor equipment. They remove oil, grease and particles without damaging components and are compatible with solvent recovery systems for sustainability.
- AFLAS® fluoroelastomers: These materials are designed for components that must withstand harsh environments. They offer outstanding resistance to heat, chemicals, fuels, acids, solvents and steam. AFLAS FFKM grades are widely used for sealing applications in semiconductor fabrication.
- RESIFA™ silica fillers: Improve insulation, signal integrity and heat resistance in electrical materials. They are critical for miniature, high-frequency electronics requiring superior transmission performance.
How Are AGC’s Materials Used in Semiconductor Fabrication?
AGC materials can be used in several key areas including:
| Process Area | Product Role |
| Molding/Encapsulation | Fluon ETFE films provide non-stick surfaces to ensure defect-free release of semiconductor packages and protect sensitive components from contamination. |
| Printed Circuit Boards | RESIFA silica fillers are added to PCB substrates to enhance signal quality and reduce loss, while PTFE and PFA coatings insulate components for reliable performance in demanding conditions. |
| Equipment and Component Protection | Fluoromaterials deliver long-lasting, contamination-free performance. ETFE/PFA is ideal for chemical delivery systems, tubing, and containers, while AFLAS® FFKM is the preferred choice for gaskets, O-rings and seals. |
| Cleanroom and Circularity Solutions | AMOLEA fluorosolvents provide a sustainable way to clean wafers, chips, PCBs and equipment while supporting resource efficiency and waste reduction. |
AGC’s advanced fluoromaterials help semiconductor manufacturers achieve the highest standards of purity, reliability and performance. From wafer processing and equipment protection to PCB fabrication and cleanroom maintenance, these materials provide the chemical resistance, thermal stability and durability required to ensure consistent, defect-free production.
AGC will showcase its portfolio of materials for semiconductor production at SEMICON West 2025 to be held October 7 – 9, 2025, at the Phoenix Convention Center in Arizona. You can learn more about AGC’s fluoropolymers for semiconductor production here.
