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RESIFA™ H SERIES Low Dielectric Fillers

 

AGC has developed two types of silica fillers providing superior low Dk and Df performance for films, molded plastics and PCB boards.

With the continual need for smaller and thinner electronics, superior transmission performance is needed at high frequencies. RESIFA™ silica is ideal for providing low Dk and DF performance because it helps minimize both electric power loss and signal loss.

Advantages of RESIFA silica

  • Low transmission loss
  • Signal stability
  • Stable along a wide temperature range

 

Applications

  • Copper clad laminates
  • PCB boards
  • Films
  • Molded plastics

AGC Chemicals